EB100-KU
EB100-KU, Fanless Embedded System with 6th/7th Gen Intel® i3/i5/i7 or Celeron®, designed with powerful and NUC-sized which is ideal for Infrared Inspection/Digital Signage/IoT Gateway applications
The BMAL box module also supports DFI’s Adaptive Display Platform (ADP) Technology. It is an innovative panel PC solution that offers the flexibility of modularized integration of panel PC components for expedited product development and shortened time to market.
A dokumentumok a DFI szerveréről töltődnek le.Documents are served from DFI's own servers.
| Item Name | Part Number | Description |
|---|---|---|
| HDD | 785-H25500G 785-H25320G 785-S25512G 785-S25256G 785-S25128G 785-S25064G 785-S25032G | 2.5" SATA HDD, 500GB, RoHS 2.5" SATA HDD, 320GB, RoHS 2.5" SATA SSD, 512GB MLC, RoHS 2.5" SATA SSD, 256GB MLC, RoHS 2.5" SATA SSD, 128GB MLC, RoHS 2.5" SATA SSD, 64GB MLC, RoHS 2.5" SATA SSD, 32GB MLC, RoHS |
| mSATA | 785-MS128GMF 785-MS64GMF 785-MS32GMF 785-MS16GMF | mSATA mini, 128GB MLC, RoHS mSATA mini, 64GB MLC, RoHS mSATA mini, 32GB MLC, RoHS mSATA mini, 16GB MLC, RoHS |
| Wi-Fi | 761-110091-000G | Wi-Fi Kit, RoHS |
| Power Card | 785-PWRD | Power Cord, Standards (USA/EUR/CH), 1.8m, RoHS |
| Power Adapter | 671-106013-000G 671-112005-100G | 60W: 12VDC/5A, DC Cord 5.5*2.5mm, Pitch 5mm, LV6, RoHS 120W: 24VDC/5A, DC Cord 5.5*2.5mm, Pitch 5mm, LV6, RoHS |
| VESA Mount | 761-TPC000-000G | ACCESSORY WALL MOUNT KITS |
Termékadatlap a gyártó oldalánProduct page on the manufacturer's site →
EB100-KU, Fanless Embedded System with 6th/7th Gen Intel® i3/i5/i7 or Celeron®, designed with powerful and NUC-sized which is ideal for Infrared Inspection/Digital Signage/IoT Gateway applications
Industrial NUC compact system, Intel Core Ultra Processor, 1 DDR5 SODIMM, 2 HDMI, up to 2 LAN, 4 USB, 2 COM, 2 USB-C
Fanless Embedded System, Intel® Processor N-series/Atom® Processor X Series, On Board OOB built-in, 2.5 GbE, DDR5, VGA/HDMI/USB-C
EC700-AL, Fanless Embedded System with Intel Atom®/Pentium®/Celeron®, designed with rugged design and Microsoft Azure IoT which is ideal for Labeling and Packaging/ harsh environments applications