26 termék
The BMAL box module also supports DFI’s Adaptive Display Platform (ADP) Technology. It is an innovative panel PC solution that offers the flexibility of modularized integration of panel PC components for expedited product development and shortened time to market.
EB100-KU, Fanless Embedded System with 6th/7th Gen Intel® i3/i5/i7 or Celeron®, designed with powerful and NUC-sized which is ideal for Infrared Inspection/Digital Signage/IoT Gateway applications
Industrial NUC compact system, Intel Core Ultra Processor, 1 DDR5 SODIMM, 2 HDMI, up to 2 LAN, 4 USB, 2 COM, 2 USB-C
Fanless Embedded System, Intel® Processor N-series/Atom® Processor X Series, On Board OOB built-in, 2.5 GbE, DDR5, VGA/HDMI/USB-C
EC700-AL, Fanless Embedded System with Intel Atom®/Pentium®/Celeron®, designed with rugged design and Microsoft Azure IoT which is ideal for Labeling and Packaging/ harsh environments applications
Fanless Embedded System, Intel® Processor Industrial RE Series, On Board OOB built-in, 2.5 GbE, DDR5, HDMI/USB-C/VGA, 3 USB 3.2 type A, 1 USB-C 3.2, 4 COM, -40 to 65°C
EC700-BT, Fanless Embedded System with Intel Atom®, designed with rugged design and Error Correcting Code(ECC) which is ideal for Factory Monitoring/robotic arms/shuttle racking system applications
The EC700-BT3054 takes full advantage of the Intel® Atom™ E3800 processor which is packed with extensive I/O capabilities including 4 Gigabit LAN, 3 COM ports, 5 USB ports to provide increased mobile computing. The optional onboard eMMC and microSD socket are designed for additional storage in space-limited environments.To ensure efficient communication, the system supports Wi-Fi and 3G/GPRS via Mini PCIe slots. EC700-BT3054 is equipped with 1 SIM card socket and 3 antenna holes making the system more suitable for environments that require wireless applications.
The EC700-BT6051/6061 takes full advantage of the Intel® Atom™ E3800 processor which is packed with extensive I/O capabilities including 2 Gigabit LAN, 6 COM ports, 5-6 USB ports to provide increased mobile computing. The optional onboard eMMC and microSD socket are designed for additional storage in space-limited environments.To ensure efficient communication, the system supports Wi-Fi and 3G/GPRS via Mini PCIe slots. EC700-BT6051/6061 is equipped with 1 SIM card socket and 3 Wi-Fi antenna holes making the system more suitable for environments that require wireless applications.
Fanless Embedded System, Intel® Processor N-series, 1 HDMI, 1 Type-C DP, 1 DDR5 SO-DIMM, 5G, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key, 3 2.5GbE LAN, 4 USB 3.2, 2 USB 2.0, 1 COM, 1 Line-out, 1 Mic-in
Fanless Robust Embedded System, 12th Gen Intel® Core™, HDMI + DP, On board memory + 1 SODIMM DDR4, 5G, 3 LAN, 4 USB3.2
Fanless Robust Embedded System, AMD Ryzen™ 8000 series, HDMI + DP, DDR5-5600, 5G, OOB, 3 LAN, 4 USB 3.2, 2 USB 3.2 Gen2, 1 USB 2.0, 1 USB Type-C, -20~60°C, -20~70°C
EC70A-KU, Fanless Embedded System with 7th Gen Intel® i3/i5/i7, designed with outstanding processing capability which is ideal for AMR/AGV/industrial automation applications
Fanless Robust Embedded System, Intel® Core™ Ultra Processor, HDMI + USB-C DP Alt. mode, LPDDR5, 5G, 3 LAN, 5 USB2.3, 1 USB Type-C, 4 COM
The EC70A-SU, which is capable of extensive I/O capabilities and increased computing performance, takes full advantage of 6th Gen Intel® Core™ i7/i5/i3 U-series processors delivering only 15 watts TDP. This new fanless system has an upgraded onboard DDR4 memory that enables accelerated exploration of complex data. In addition, the fanless thermal design provides sufficient heat dissipation for space-limited environments. Due to the advanced I/O expandability (2 Intel GbE, 4 COM, 4 USB 3.0, 1 VGA, and 1 DP++), it makes the system suitable for a variety of embedded applications in smart factory, IoT networks, digital signage, digital healthcare, etc.
DFI's EC70A-TGU is the 5G-module support Fanless Embedded System powered by 11th Gen Intel® Core Processors. It is ideal for AMR/AGV, machine vision and other industrial automation applications. EC70A-TGU supports DDR4, 5G cellular, 3 M.2, 2 HDMI, 1 VGA, 4 COM, up to 4 LAN or 6 USB 3.1.
The EC70B-SU is a fanless industrial box PC powered by 6th Generation Intel® Core™-i processor. This small but powerful embedded computer is equipped with high-end Intel Core CPU to deliver increased computing frequencies and performance. It brings rich and specific I/O connectivity to support up to 2 PoE LAN, 2 Giga LAN, 6 COM ports, and 6 USB 3.0, which makes it a perfect candidate for machine vision application. The system also features fast DDR4 onboard memory, Mini PCIe & M.2 expansion for Wi-Fi/LTE/SATA modules, and a -20°C to 60°C operating temperature range. EC70A-SU box PC ideally suits computing intensive applications and continuous operations in challenging environments.
EC800-AL, Fanless Embedded System with Intel Atom®/Pentium®, designed with rugged design which is ideal for Smart Charging/industrial control/automation applications
Modular-Designed System, NXP i.MX8M Mini platform, M.2 support, PoE, 1 HDMI, LPDDR4, 2 GbE LAN, 2 USB, RS422, RS485
DFI's EC900-FS6 is a Fanless Embedded System with DIN Rail, ARM-based powered by NXP i.MX6 Series Processor. It brings flexible perfect for Air compressors, steel, electricity, metallurgy, shipbuilding, textile, chemical, oil and gas, paper and printing, food and medicine, casting and spraying, shipping and terminal, automobile industry, aerospace and infrastructure, and more. DFI EC900-FS6 support NXP i.MX6 Series, DDR3L, 1 Mini PCIe, 1 HDMI.
Ultra Small Size Embedded System, Qualcomm® QCS6490, LPDDR5x memory down, M.2 E key, M.2 B key, 2 USB 3.1, 1 GbE, 1 HDMI, 1 Audio Jack, 1 COM, 8-bit DIO, AMR
EC90A-AL, Fanless Embedded System with Intel Atom®, designed with unprecedented high mobility which is ideal for IIOT sensors/video systems/harsh environments applications
Smallest Ryzen™ Pi Box! DFI's EC90A-GH is the industrial mini pc system powered by AMD Ryzen™ CPU. It designed for AIoT edge computing, AI vision, SCARA, track monitoring, and more. DFI EC90A-GH support AMD Ryzen™, SIM card/LTE/Wifi, Ultra Small Size Fanless, 1 Mini PCIe, 2 Micro HDMI.
DFI's ED700-EHL/ED700-EHL22I is the 5G-module support Fanless Embedded System powered by Intel® Atom® Processors X Series. It is ideal for AMR/AGV, machine vision and other industrial automation applications. ED700-EHL supports 5G cellular, 2.5GbE TSN, 3 M.2, 1 VGA, 4 COM, up to 4 LAN or 4 USB 3.1.
DFI's ES220F-CS is a fanless Industrial Computer powered by 8th/9th Gen Intel Core Processors. It brings versatility perfect for AI License Plate identification, Technology Enforcement, Traffic Flow, MaaS, and more. DFI ES220F-CS supports 2 HDMI 2.0 @60Hz, 8th/9th Gen Intel® Core™, DDR4, M.2, 2.5" SSD, 6 USB, 2 LAN, 2 COM.
Stand type Chassis, Mini-ITX form factor, 1x 2.5" SATA bay, 2 USB, 2 Audio Jack, ODD Drive Bay, Compact system, System Fan
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