CH960-CM246/QM370
COM Express Type 6, 8th/9th Gen Intel® Core™, Intel® CM246/QM370, DDR4, 1 PCIe x16, 8 PCIe x1,12 USB, 4 SATA 3.0, 1 VGA, 1 LVDS, 2 DDI
COM Express Type 6, AMD® Ryzen™ V1000/R1000, DDR4, 1 PCIe x8, 7 PCIe x1, 12 USB, 1 or 2 SATA 3.0, 1 VGA/DDI, 1 LVDS/eDP, 2 DDI
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| Model Name | Part Number | Description |
|---|---|---|
| GH960-TS-V1807B | 770-GH9602-000G | AMD® Ryzen™ V1807B processor, 1 VGA, 1 LVDS, 1 LAN, 4 USB 3.1 Gen1, 8 USB 2.0, 2 SODIMM DDR4, -40 to 85°C |
| GH960-TS-V1756B | 770-GH9602-200G | AMD® Ryzen™ V1756B processor, 1 VGGH9602A, 1 LVDS, 1 LAN, 4 USB 3.1 Gen1, 8 USB 2.0, 2 SODIMM DDR4, -40 to 85°C |
| GH960-BS-V1202B | 770-GH9602-300G | AMD® Ryzen™ V1202B processor, 1 VGA, 1 LVDS, 1 LAN, 4 USB 3.1 Gen1, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C |
| GH960-TS-R1606G | 770-GH9602-500G | AMD® Ryzen™ R1606G processor, 1 LVDS, 1 LAN, 4 USB 3.1 Gen1, 8 USB 2.0, 2 SODIMM DDR4, -40 to 85°C |
| GH960-BS-V1605B | 770-GH9602-600G | AMD® Ryzen™ V1605B processor, 1 VGA, 1 LVDS, 1 LAN, 4 USB 3.1 Gen1, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C |
| GH960-BS-R1505G | 770-GH9602-700G | AMD® Ryzen™ R1505G processor, 1 LVDS, 1 LAN, 4 USB 3.1 Gen1, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C |
| GH960-TS-V1404I | 770-GH9602-800G | AMD® Ryzen™ V1404I processor, 1 VGA, 1 LVDS, 1 LAN, 4 USB 3.1 Gen1, 8 USB 2.0, 2 SODIMM DDR4, -40 to 85°C |
| Item Name | Part Number | Description |
|---|---|---|
| Carrier board kit | 770-CM3322-000G | |
| Heat spreader (Height: 11mm) | A71-808323-000G |
Termékadatlap a gyártó oldalánProduct page on the manufacturer's site →
COM Express Type 6, 8th/9th Gen Intel® Core™, Intel® CM246/QM370, DDR4, 1 PCIe x16, 8 PCIe x1,12 USB, 4 SATA 3.0, 1 VGA, 1 LVDS, 2 DDI
COM Express Type 6, 8th/9th Gen Intel® Core™, Intel® HM370, DDR4, 1 PCIe x16, 8 PCIe x1,12 USB, 4 SATA 3.0, 1 VGA, 1 LVDS, 2 DDI
COM Express Type 6, 8th/9th Gen Intel® Core™, Intel® CM246/QM370/HM370, DDR4, 1 PCIe x16, 8 PCIe x1,12 USB, 4 SATA 3.0, 1 VGA, 1 LVDS, 2 DDI
DV970, COM Express Basic with Intel Atom®, designed with 4x 10Gbase-KR which is ideal for 5G Small Cell POC/factory gateway/emerging appliances/NAS applications