CH960-CM246/QM370
COM Express Type 6, 8th/9th Gen Intel® Core™, Intel® CM246/QM370, DDR4, 1 PCIe x16, 8 PCIe x1,12 USB, 4 SATA 3.0, 1 VGA, 1 LVDS, 2 DDI
ICD970
COM Express R3.0 Type 7, 3rd Gen Intel® Xeon® Processor D-1700 Family, DDR4, 1 PCIe x16, 4 PCIe x8, 8 PCIe x4, 8 PCIe x2, 2 SATA 3.0, 4 10G LAN, 2 UART, 1 I2C, 4 USB 3.0, 4 USB 2.0, -40 to 85°C
- 3rd Gen Intel® Xeon® Processor D-1700 Family
- Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB, 3rd DIMM by request(SDPC mode by request to support DDR4 2933MHz)
- Support extended operating temperature: -40 to 85°C
- 10GBASE-KR: Support up to 4 x 10GbE Mac ports
- Multiple Expansion: 1 PCIe x16 (Gen4), 2 PCIe x8 (Gen3), 1 SMBus, 1 I2C, 1 LPC, 2 UART (TX/RX)
- Rich I/O: 2 Intel GbE, 4 USB 3.0, 4 USB 2.0, 2 SATA 3.0
- 15-Year CPU Life Cycle Support Until Q1' 37 (Based on Intel IOTG Roadmap)
Főbb jellemzők
Tanúsítványok
#Edge AI Computing
#Slim Bootloader
#IoT
#Intel
#5G
#Fanless Design
#PCIe x16
#Windows
#Linux
#Multiple Expansion
#10G Ethernet
#DDR4
#RoHS Certification
#CE Certification
#FCC Certification
#High-Performance
#Medical
#Intel® 3rd Gen Xeon Ice Lake-SP Processor
Főbb jellemzőkKey features
- 3rd Gen Intel® Xeon® Processor D-1700 Family
- Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB, 3rd DIMM by request(SDPC mode by request to support DDR4 2933MHz)
- Support extended operating temperature: -40 to 85°C
- 10GBASE-KR: Support up to 4 x 10GbE Mac ports
- Multiple Expansion: 1 PCIe x16 (Gen4), 2 PCIe x8 (Gen3), 1 SMBus, 1 I2C, 1 LPC, 2 UART (TX/RX)
- Rich I/O: 2 Intel GbE, 4 USB 3.0, 4 USB 2.0, 2 SATA 3.0
- 15-Year CPU Life Cycle Support Until Q1' 37 (Based on Intel IOTG Roadmap)
System
- Processor
- 3rd Gen Intel® Xeon® Scalable Processors D-1700 Family Intel® Xeon® D-1746TER Processor, 10 Cores, 15MB Cache, 2.0GHz, 67W Intel® Xeon® D-1735TR Processor, 8 Cores, 15MB Cache, 2.2GHz, 59W Intel® Xeon® D-1732TE Processor, 8 Cores, 15MB Cache, 1.9GHz, 52W Intel® Xeon® D-1715TER Processor, 4 Cores, 10MB Cache, 2.4GHz, 50W Intel® Xeon® D-1712TR Processor, 4 Cores, 10MB Cache, 2.0GHz, 40W
- Memory
- Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB 3rd DIMM by request (SDPC mode by request to support DDR4 2933MHz)
- BIOS
- Insyde SPI 512Mbit
Expansion
- Interface
- Default: B1: 1 x PCIe x8 or 2 x PCIe x4 or 4x PCIe x2 (Gen 3) B2: 1 x PCIe x8 or 2 x PCIe x4 or 4x PCIe x2 (Gen 3) B3/B4: 1 x PCIe x16 or 2 x PCIe x8 or 4x PCIe x4 (Gen 4) 1 x LPC 1 x I2C 1 x SMBus 2 x UART (TX/RX)
Ethernet
- Controller
- Supports up to 4 x 10GBASE-KR interfaces and max up to 4 x 10GbE MAC ports (maximum bandwidth 40Gb by activating the 4 x 10GbE at the same time) 1 x Intel® I210AT (10/100/1000Mbps) (0 to 60°C) or 1 x Intel® I210IT (10/100/1000Mbps) (-40 to 85°C)
I/O
- USB
- 4 x USB 3.0 4 x USB 2.0
- SATA
- 2 x SATA 3.0 (up to 6Gb/s)
- DIO
- 1 x 8-bit DIO (4 in, 4 out)
Watchdog Timer
- Output & Interval
- System Reset, Programmable via Software from 1 to 255 Seconds
Security
- TPM
- Default TPM2.0, fTPM by request
Power
- Type
- 12V, 5VSB, VCC_RTC (ATX mode) 12V, VCC_RTC (AT mode)
- Consumption
- Typical: 71.36W Max: 72.36W
OS Support
- Microsoft
- Windows Server 2019, 2022
- Linux
- Ubuntu 20.04, CentOS 7.5
Environment
- Temperature
- Operating: 0 to 60°C, -40 to 85°C Storage: -40 to 85°C
- Humidity
- Operating: 5 to 90% RH Storage: 5 to 90% RH
- MTBF
- 277,731hrs @25°C; 144,676hrs @45°C; 81,589hrs @60°C; 55,811hrs @70°C; 37,526 @85°C Calculation model: Telcordia Issue 4 Environment: GB, GC – Ground Benign, Controlled
Mechanism
- Dimensions
- COM Express® Basic 95mm (3.74") x 125mm (4.9")
- Compliance
- PICMG COM Express® R3.0, Type 7
Standards and Certifications
- Certifications
- CE, FCC, RoHS
Packing List
- Packing List
- 1 ICD970 board 1 Cooler (Height: 47.80 mm) 0 to 60°C: TBD / -40 to 85°C: TBD
Country of Origin
- Country of Origin
- Taiwan
Product Collaterals
Technical Documents
A dokumentumok a DFI szerveréről töltődnek le.Documents are served from DFI's own servers.
| Model Name | Part Number | Description |
|---|---|---|
| ICD970-TS-1746 | 770-ICD9701-000G | Intel® Xeon® D-1746TER (67W), eMMC 16GB, TPM 2.0, Termal: Cooler, Operating temp.: -40~85°C |
| ICD970-BS-1712 | 770-ICD9701-100G | Intel® Xeon® D-1712TR (40W), eMMC 16GB, TPM 2.0, Termal: Cooler, Operating temp.: 0~60°C |
| ICD970-TS-1715 | 770-ICD9701-200G | Intel® Xeon® D-1715TER (50W), eMMC 16GB, TPM 2.0, Thermal: Cooler, Operating temp.: -40~85°C |
| Item Name | Part Number | Description |
|---|---|---|
| COM336 carrier board kit | 770-COM3361-000G | |
| Heat spreader | A71-808352-000G |
Termékadatlap a gyártó oldalánProduct page on the manufacturer's site →
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